Reducing contact resistance in vias for copper interconnects

ABSTRACT

A method of forming an electrical transmission structure that includes forming an opening through an interlevel dielectric layer to expose at least one electrically conductive feature and forming a shield layer on the opening. A gouge is formed in the electrically conductive feature through the opening using a subtractive method during which the shield layer protects the interlevel dielectric layer from being damaged by the subtractive method. A contact is formed within the opening in electrical communication with the at least one electrically conductive feature.

BACKGROUND Technical Field

The present disclosure relates to interconnect devices and structuresfor transmitting electrical current.

Description of the Related Art

As the technology node advances in semiconductor devices, the dimensionsof the semiconductor devices continue to decrease. As millions ofdevices and circuits are positioned onto a semiconductor chip, thewiring density and the number of metal levels are increased generationafter generation. As interconnect dimensions continue to decrease, thecontact resistance within the vias that allow power to flow betweenmetallization levels represents a larger component to the overallresistance of the electrical device including the interconnects.

SUMMARY

In one embodiment, an interconnect structure is provided that mayinclude an interlevel dielectric layer on an electrically conductivefeature; and an opening present in the interlevel dielectric layer. Theopening may include a first width at a first depth into the interleveldielectric layer, and a second width at a second depth that is greaterthan the first depth, wherein the second width is less than the firstwidth of the opening. The portion of the opening having the second widthincludes a portion of the opening that extending through the entirety ofthe interlevel dielectric layer into contact with the electricallyconductive feature. A contact may be present extending through theopening into contact with the electrically conductive feature, wherein agouge is present at the interface of the contact and the electricallyconductive feature. A shield liner can be present on the verticalsidewalls of the opening between the interlevel dielectric layer and thecontact.

In another aspect of the present disclosure, a method of forming anelectrical transmission structures is provided. In one embodiment, themethod of forming the electrical transmission structure includes formingan interlevel dielectric layer atop a substrate including at least oneelectrically conductive feature, and forming an opening through theinterlevel dielectric layer to expose a portion of the at least oneelectrically conductive feature. A shield layer may then be formed onthe opening. The shield layer can be formed using a non-conformalprocess to provide a greater thickness of shield material on horizontalsurfaces of the opening in comparison to vertical surfaces of theopening. This can provide that the shield layer has a greater heightadjacent to the vertical surfaces than a height of the shield layer atopthe horizontal surfaces. A gouge may then be formed in the electricallyconductive feature through the opening using a subtractive method. Theshield layer protects the interlevel dielectric layer from being damagedby the subtractive method. A contact may be formed within the opening inelectrical communication with the at least one electrically conductivefeature.

In another embodiment, the method of forming the electrical transmissionstructure may include forming an opening through an interleveldielectric layer to expose a portion of at least one electricallyconductive feature that is present underlying the interlevel dielectriclayer, and forming a shield layer on horizontal surfaces and verticalthickness on horizontal surfaces of the opening in comparison to theshield layer present on the vertical surfaces of the opening, whichprovides that the shield layer has a greater height adjacent to thevertical surfaces of the opening than the height of the shield layeratop the horizontal surfaces of the opening. In a following step, agouge may be formed in the electrically conductive feature through theopening using an ion plasma method.

The ion plasma method removes a portion of an upper surface of theelectrically conductive features, as well as the shielding present onthe electrically conductive features. A contact may be formed within theopening in electrical communication with the at least one electricallyconductive feature.

BRIEF DESCRIPTION OF DRAWINGS

The disclosure will provide details in the following description ofpreferred embodiments with reference to the following figures wherein:

FIG. 1 is a side cross-sectional view depicting forming an openingthrough an interlevel dielectric layer to expose a portion of at leastone electrically conductive feature that is present underlying theinterlevel dielectric layer, in accordance with one embodiment of thepresent disclosure.

FIG. 2 is a side cross-sectional view depicting one embodiment offorming a liner layer on the horizontal and vertical surfaces of theopening depicted in FIG. 1.

FIG. 3 is a side cross-sectional view depicting forming a shield layeron horizontal surfaces and vertical surfaces of the opening in theinterlevel dielectric layer, in accordance with one embodiment of thepresent disclosure.

FIG. 4 is a side cross-sectional view depicting one embodiment offorming a gouge in the electrically conductive feature through theopening, in accordance with one embodiment of the present disclosure.

FIG. 5A is a side cross-sectional view of a gouge that is formed in theelectrically conductive feature, in which the gouge includes angledsidewalls extending to a substantially planar base, in accordance withone embodiment of the present disclosure.

FIG. 5B is a side cross-sectional view of a gouge that is formed in theelectrically conductive feature, in which the gouge includes angledsidewalls extending to an apex at a base of the gouge.

FIG. 6 is a side cross-sectional view depicting forming a contact withinthe opening in electrical communication with the at least oneelectrically conductive feature, in accordance with one embodiment ofthe present disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Detailed embodiments of the claimed structures and methods are disclosedherein; however, it is to be understood that the disclosed embodimentsare merely illustrative of the claimed structures and methods that maybe embodied in various forms.

In addition, each of the examples given in connection with the variousembodiments are intended to be illustrative, and not restrictive.Further, the figures are not necessarily to scale, some features may beexaggerated to show details of particular components. Therefore,specific structural and functional details disclosed herein are not tobe interpreted as limiting, but merely as a representative basis forteaching one skilled in the art to variously employ the methods andstructures of the present disclosure. For purposes of the descriptionhereinafter, the terms “upper”, “lower”, “right”, “left”, “vertical”,“horizontal”, “top”, “bottom”, and derivatives thereof shall relate tothe embodiments of the disclosure, as it is oriented in the drawingfigures. The terms “present on” means that a first element, such as afirst structure, is present on a second element, such as a secondstructure, wherein intervening elements, such as an interface structure,e.g. interface layer, may be present between the first element and thesecond element. The term “direct contact” means that a first element,such as a first structure, and a second element, such as a secondstructure, are connected without any intermediary conducting, insulatingor semiconductor layers at the interface of the two elements.

As interconnect dimensions continue to decrease, the contact resistancewithin vias that allow power to flow between metallization levelsrepresents a larger component to the overall resistance. In particular,it has been determined that the contact between the liner material atthe via bottom and the underlying metallization can dominate the viaresistance. In some examples, opening the underlying metallization,e.g., electrically conductive features, at the via bottom by forming agouge creates a larger contact surface area that can lower resistance.However, this method of forming a gouge in the metallization at the viabottom can also damage the interlevel dielectric (ILD) surfaces that areexposed during this process. The resulting damaged ILD surfaces are alsoroughened, which can subsequently lead to poor liner material coverage.It has also been determined that using lower dielectric constant ILDmaterials cam exacerbate the above described issue.

In some embodiments, the methods and structures that are disclosedherein can create increased surface area at the bottom of metallizationvias without damaging the exposed ILD surfaces. For example, in someembodiments, the methods and structures that are disclosed herein canemploy a shield liner to protect the exposed ILD surfaces during etchingof the underlying via bottom. The shield liner disclosed herein iscompatible with current back-end-of-line (BEOL) processing and willresult in better yield of interconnects with lower contact resistance.For example, the shield liner may be deposited on top of a conventionalliner, e.g., metal nitride layer, such as a conformal tantalum nitride(TaN) or titanium nitride (TiN), after the ILD trench/via opening hasbeen formed. In some embodiments, the shield liner is composed ofinsulating or conductive material, and is designed to be thinner at thevia bottom than in the field region. Subsequent etching to further openthe via can completely remove the shield liner at the via bottom but noton the other horizontal surfaces, which can protect them from beingdamaged during the etch steps for forming the gouge in the electricallyconductive feature. Some embodiments of the methods and structuresdisclosed herein, are now described in more detail with reference toFIGS. 1-6.

FIG. 1 depicts forming an opening 10 through an interlevel dielectriclayer 15 a, 15 b to expose a portion of at least one electricallyconductive feature 20 that is present underlying the interleveldielectric layer 15 a, 15 b. The term “electrically conductive feature”denotes a conductive structure that transmits an electrical signal,e.g., electrical current, from one portion of a device to at least asecond portion of the device. The electrically conductive feature mayprovide for electrical communication in a horizontal direction, i.e.,along a plane extending parallel to an upper surface of a device. Inthis manner, the electrically conductive feature may be a metal lineand/or wiring.

The structure shown in FIG. 1 can be fabricated using interconnecttechniques, which can include employing a wafer (not shown) includingvarious semiconductor devices (not shown), and forming a firstdielectric layer 25 atop the wafer. The first dielectric layer 25 can becomposed of any dielectric material, including but not limited to, SiO₂,Si₃N₄, SiCOH, SiLK, porous dielectric, and combinations thereof.Embedded within first dielectric layer 25 is a first level of metalwiring, which is referred to hereafter as the electrically conductivefeature 20. The electrically conductive feature 20 may be composed ofany electrically conductive material. “Electrically conductive” as usedthrough the present disclosure means a material typically having a roomtemperature conductivity of greater than 10⁷(Ω-m)⁻¹. Examples ofelectrically conductive materials that are suitable for the electricallyconductive features include Cu, Al, Al(Cu), W and combinations thereof.

The first dielectric layer 25 may be formed on a substrate (not shown),such as a semiconductor or insulating substrate, using a depositionprocess, such as chemical vapor deposition, plasma enhanced chemicalvapor deposition, chemical solution deposition, physical vapordeposition, and spin on deposition. Following formation of the firstdielectric layer 25, the electrically conductive features 20 may beformed using photolithography, etching and deposition processes. Forexample, in some embodiments, a pattern is produced on the firstdielectric layer 25 by applying a photoresist to the surface to beetched; exposing the photoresist to a pattern of radiation; and thendeveloping the pattern into the photoresist utilizing resist developer.Once the patterning of the photoresist is completed, the sections of thefirst dielectric layer 25 that are covered by the photoresist areprotected while the exposed regions are removed using a selectiveetching process that removes the unprotected regions. The etch processmay be an anisotropic etch, such as reactive ion etch. After forming thetrench, the photoresist mask may be removed using chemical stripping,selective etching or oxygen ashing. A conductive material may then bedeposited in the trench to provide the electrically conductive features20 using a deposition process, such as plating or sputtering. Aplanarization process, such as chemical mechanical planarization (CMP),may be employed so that an upper surface of the electrically conductivefeatures 20 are coplanar with the upper surface of the first dielectriclayer 25.

Still referring to FIG. 1, the interlevel dielectric layers 15 a, 15 bmay then be formed over the electrically conductive features 20 and thefirst dielectric layer 25 a. In one example, a capping layer 15 b may beformed on the upper surface of the electrically conductive features 20and the first dielectric layer 25. The capping layer 15 b may becomposed of a dielectric material, such as an oxide or nitride. Forexample, the capping layer 15 b may be composed of a silicon nitride(Si₃N₄), silicon carbide (SiC), SiC(N,H) and combinations thereof. Thecapping layer 15 b may be deposited using a deposition process, such aschemical vapor deposition (CVD). Examples of CVD that are suitable forforming the capping layer 15 b include, but are not limited to,Atmospheric Pressure CVD (APCVD), Low Pressure CVD (LPCVD) and PlasmaEnhanced CVD (EPCVD), Metal-Organic CVD (MOCVD) and combinationsthereof. The thickness of the capping layer 15 a may range from 10 nm to25 nm.

A second dielectric layer 15 a may then be formed on the capping layer15 b. The second dielectric layer 15 a may be composed of any dielectriclayer. For example, the second dielectric layer 15 a may be composed ofSiO₂, Si₃N₄, SiCOH, SiLK, and combinations thereof. In some examples,the second dielectric layer 15 a may be composed of a low-k dielectric.The term “low-k” denotes a material having a dielectric constant that isless than silicon dioxide at room temperature (e.g., 25° C.). In oneembodiment, a second dielectric layer 15 a of a low-k dielectric has adielectric constant that is less than 4.0, e.g., 3.9. In anotherembodiment, a second dielectric layer 15 a of a low-k dielectric mayhave a dielectric constant ranging from 1.75 to 3.5. In yet anotherembodiment, a second dielectric layer 15 a of a low-k dielectric mayhave a dielectric constant ranging from 2.0 to 3.2. Examples ofmaterials suitable for a low-k dielectric that can provide the seconddielectric layer 15 a include organosilicate glass (OSG), fluorine dopedsilicon dioxide, carbon doped silicon dioxide, porous silicon dioxide,porous carbon doped silicon dioxide, spin-on organic polymericdielectrics (e.g., SILK™), spin-on silicone based polymeric dielectric(e.g., hydrogen silsesquioxane (HSQ), undoped silica glass, diamond likecarbon (DLC), methylsilsesquioxane (MSQ) and combinations thereof.

Still referring to FIG. 1, an opening 10 may then be formed in theinterlevel dielectric layers 15 a, 15 b. The opening 10 may be formedthrough the interlevel dielectric layers 15 a, 15 b to expose a portionof the at least one electrically conductive feature 20. In someembodiments, the opening 10 includes a first width W1 at a first depthinto the interlevel dielectric layers 15 a, and a second width W2 at asecond depth into the interlevel dielectric layer 15 a that is greaterthan the first depth. The second width W2 is equal to or less than thefirst width W1 of the opening 10, and includes a portion of the opening10 that extending through the entirety of the interlevel dielectriclayers 15 a, 15 b into contact with the electrically conductive feature20. For example, the first width W1 may range from 5 nm to 200 nm, andthe second width W2 may range from 5 nm to 200 nm. In another example,the first width W1 may range from 14 nm to 40 nm, and the second widthW2 may range from 14 nm to 40 nm.

The opening 10 may be formed using deposition, photolithography and etchprocesses. In one embodiment, the opening 10 may be formed using a dualdamascene process. The dual-damascene process is characterized bypatterning the vias and trenches, in such a way that the metaldeposition for forming the electrically conductive fill for the via andtrench fills both at the same time. The interlevel dielectric layer 15 ais patterned using lithography and etching techniques to form a via andtrench. For example, in some embodiments, a pattern is produced on theinterlevel dielectric layer 15 a by applying a photoresist to thesurface to be etched; exposing the photoresist to a pattern ofradiation; and then developing the pattern into the photoresistutilizing resist developer. Once the patterning of the photoresist iscompleted, the sections of the interlevel dielectric layer 15 a and thecapping layer 15 b that are covered by the photoresist are protectedwhile the exposed regions are removed using a selective etching processthat removes the unprotected regions. The etch process may be ananisotropic etch, such as reactive ion etch. In some embodiments, theetch process is a selective etch. As used herein, the term “selective”in reference to a material removal process denotes that the rate ofmaterial removal for a first material is greater than the rate ofremoval for at least another material of the structure to which thematerial removal process is being applied. For example, in someembodiments, the capping layer 15 b may be removed by an etch chemistrythat is selective to the electrically conductive feature 20. Afterforming the vias and trenches, the photoresist mask may be removed usingchemical stripping, selective etching or oxygen ashing. The opening 10may include horizontal surfaces H1, H2 and vertical surfaces V1, V2 asdepicted in FIG. 1.

FIG. 2 depicts one embodiment of forming a liner layer 30 on thehorizontal H1, H2 and vertical surfaces V1, V2 of the opening 10depicted in FIG. 1. In the embodiments in which the lines andinterconnects formed within the opening are composed of copper (Cu), theliner layer 30 may be a tantalum (Ta) based layer. The liner layer 30may also be composed of TaN, Ta, Ti, Ti(Si)N, Ru, W, Ir, SiO₂, Si₃N₄,SiC, SiC(N,H), and combinations thereof. In some embodiments, the linerlayer 30 obstructs copper (Cu) atoms from migrating into the interleveldielectric (ILD) layer 15 a. In some embodiments, the liner layer 30provides good adhesion for the subsequently deposited metal fill, suchas copper metal fill. In yet other embodiments, the liner layer 30 mayalso function as an oxygen getter, seed layer and adhesion promoter. Theliner layer 30 is typically deposited using a conformal depositionprocess. The term “conformal” denotes a layer having a thickness thatdoes not deviate from greater than or less than 30% of an average valuefor the thickness of the layer. In some embodiments, the liner layer 30may be deposited using chemical vapor deposition, such as plasmaenhanced chemical vapor deposition (PECVD). In other embodiments, theliner layer 20 may be deposited using atomic layer deposition (ALD). Theliner layer 30 may have a thickness ranging from 1 nm to 10 nm. In someembodiments, the liner layer 30 may be omitted.

FIG. 3 depicts one embodiment of forming a shield layer 35 on horizontalsurfaces H1, H2 and vertical surfaces V1, V2 of the opening 10 in theinterlevel dielectric layers 15 a, 15 b. The shield layer 35 is formedwith a non-conformal process to provide a greater thickness of shieldmaterial on horizontal surfaces of the opening in comparison to verticalsurfaces of the opening 10. The term “non-conformal” denotes a layerhaving a thickness that does deviate from greater than 30% of an averagevalue for the thickness of the layer. For example, the thickness T1 ofthe shield material that is present on the horizontal surfaces H1, H2may range from 3 nm to 150 nm, and the thickness T2 of the shieldmaterial that is present on the vertical surfaces V1, V2 may range from1 nm to 50 nm. In another example, the thickness T1 of the shieldmaterial that is present on the horizontal surfaces H1, H2 may rangefrom 5 nm to 30 nm, and the thickness T2 of the shield material that ispresent on the vertical surfaces V1, V2 may range from 2 nm to 10 nm.The non-conformal deposition of the shield material for the shield layer35 can provide that the shield layer 35 having a greater height H3,i.e., measured from the upper surface electrically conductive material30, adjacent to the vertical surfaces V1, V2 of the opening 10 than aheight H4 of the shield layer 35 atop the horizontal surfaces H1, H2 ofthe opening 10. In some embodiments, the portion of the shield layerthat is present on the electrically conductive feature 20 may have athickness that is less than the thickness of the shield layer 20 that ispresent on the horizontal surfaces H1, H2 of the interlevel dielectriclayer 15 b.

The shield layer 35 may be composed of electrically conductive ordielectric materials. For example, the shield layer 35 may be composedof silicon nitride, silicon oxide, silicon carbide, Ta(N), Ti(N) andcombinations thereof. The shield layer 35 may be deposited by anynon-conformal deposition process. For example, the shield layer 35 maybe deposited using chemical vapor deposition processes, such as plasmaenhanced chemical vapor deposition (PECVD) or physical vapor deposition(PVD), in which non-conformity of the deposition process may be providedby adjusting the deposition pressure or controlling the vacuum conditionwithin the deposition chamber. In some embodiments, the liner layer 30may be positioned between the shield layer 35 and the sidewalls of theopening 10 provided by the interlevel dielectric layer 15 a, 15 b, andthe electrically conductive feature 20.

FIG. 4 depicts one embodiment of forming a gouge 40 in the electricallyconductive feature 20 through the opening 10. In some embodiments, thegouge 40 in the electrically conductive feature 20 may be formed using asubtractive method. The term “subtractive method” denotes a process thatremoves material. Examples of subtractive methods may include etching,ion bombardment, laser ablation and combinations thereof. In oneembodiment, the subtractive method includes bombardment of thestructures within the opening 10 with a gaseous ion plasma. For example,the gaseous ion plasma may be composed of argon (Ar), helium (He), neon(Ne), xeon (Xe), nitrogen (N₂), hydrogen (H₂), ammonia (NH₃), diazene(N₂H₂) and combinations thereof. Typically, the gaseous ion plasmasubtractive method is an anisotropic process. As used herein, an“anisotropic process” denotes a material removal process in which thematerial removal rate in the direction normal to the surface to beremoved is greater than in the direction parallel to the surface to beremoved.

In other examples, the subtractive method may be an anisotropic etchprocess, such as reactive ion etch. Reactive Ion Etching (RIE) is a formof plasma etching in which during etching the surface to be etched isplaced on the RF powered electrode. Moreover, during RIE the surface tobe etched takes on a potential that accelerates the etching speciesextracted from plasma toward the surface, in which the chemical etchingreaction is taking place in the direction normal to the surface. Otherexamples of anisotropic etching that can be used at this point of thepresent disclosure include ion beam etching, plasma etching or laserablation.

Referring to FIG. 4, in some embodiments, the shield layer 35 protectsthe interlevel dielectric layer 15 a, 15 b from being damaged by thesubtractive method. Further, because the shield layer 35 is present overthe portion of the liner layer 30 that is present on the sidewalls ofthe opening 10, i.e., horizontal H1, H2 and vertical surfaces V1, V2,the shield layer 35 protects the liner layer 30 from being damaged bythe subtractive method. The subtractive method is typically ananisotropic method. Therefore, the active elements of the subtractivemethod, e.g., plasma ions, that impact the horizontal upper surface ofthe electrically conductive feature 20 to form the gouge 40, also impactthe horizontal surfaces H1, H2 of the opening 10, as well as anymaterial that is present on the horizontal surfaces H1, H2 of theopening. If the shield layer 35 is not present, applying the subtractivemethod to the upper surface of the electrically conductive feature 20would remove material not only from the electrically conductive features20, but would also damage the horizontal surfaces H1, H2 of theinterlevel dielectric layer 15 a, 15 b, as well as any material layerthat was present on the horizontal surfaces H1, H2 of the interleveldielectric layer 15 a, 15 b. The presence of the shield layer 35protects the horizontal surfaces H1, H2 and the underlying structuresfrom being damaged by the subtractive method that forms the gouge 40 inthe electrically conductive features 20.

For example, the subtractive method is blanket applied to the entiretyof the opening 10. The subtractive method removes material from theshield layer 35, in which the height H3 of the shield layer 35 adjacentto the vertical surfaces of the interlevel dielectric layer 15 a, 15 bis greater than the height H4 of the shield layer 35 on the horizontalsurfaces of the interlevel dielectric layer. In some embodiments, theheight H4 of the shield layer 35 on the horizontal surfaces H1, H2 maybe greater than the height of the shield layer 35 on the electricallyconductive features 20. In this embodiment, the subtractive method iscontinued until an entirety of the shield layer 35 is removed from theupper surface of the electrically conductive feature 20, and continuesto form a gouge 40 in the upper surface of the electrically conductivefeature 20. Because the height of the shield layer 35 on the horizontalsurfaces H1, H2 of the opening 10 is greater than the height of theshield layer 35 on the upper surface of the electrically conductivefeature 20, when the entirety of the shield layer 35 is removed from theupper surface of the electrically conductive feature, a portion of theshield layer 35 remains on the horizontal surfaces H1, H2 of the openingto protect those surfaces from being damaged by the subtractive methodfor forming the gouge 40. As the subtractive method continues to beapplied in forming the gouge 40, the portion of the shield layer 35 thatis present on the horizontal surfaces H1, H2 of the interleveldielectric layer 35 may also be removed. In some embodiments, at theconclusion of forming the gouge 40 in the electrically conductivefeature 20, the portions of the shield layer 35 in direct contact withthe vertical surfaces V1, V2 of the interlevel dielectric layer 15 a, 15b remain, since those portions of the shield layer 35 can have thegreatest height H3.

In some embodiments, the gouge 40 may have a depth H5 into theelectrically conductive feature 20 ranging from 1 nm to 200 nm. In otherembodiments, the gouge 40 may have a depth H5 into the electricallyconductive feature 20 ranging from 3 nm to 100 nm. The gouge 40 that isformed in the electrically conductive feature 20 increases the contactsurface area of the interface between the electrically conductivefeature 20 and the subsequently formed metal fill that is formed in theopening 10. Further, because the liner layer 30 is formed prior to theshield layer 35, the liner layer 30 is formed on an undamaged surface ofthe interlevel dielectric layers 15 a, 15 b, an is present in acontinuous and conformal manner.

FIG. 5A depicts a gouge 40 that is formed in the electrically conductivefeature 20, in which the gouge 40 includes angled sidewalls 41 extendingto a substantially planar base 42. FIG. 5B depicts a gouge 40 that isformed in the electrically conductive feature 20, in which the gouge 40includes angled sidewalls 41 extending to an apex 43 at a base of thegouge 40.

FIG. 6 depicts forming an interconnect contact 45 within the opening 10in electrical communication with the at least one electricallyconductive feature 20. The interconnect contact 45 may include a metalfill that also fills the gouge 40. In some embodiments the interconnectcontact 45 may be composed of copper (Cu). In some embodiments formingthe copper (Cu) fill to provide the electrically conductive feature maybegin with a thin Cu seed that is deposited by physical vapor deposition(PVD) followed by the electroplating of Cu, which fills the via andtrench portions of the opening 10. The excess Cu is removed by achemical mechanical polishing process (CMP) and an etch stop layer (alsocalled capping layer), typically SiN based, is deposited.

In one embodiment, the copper including material of the interconnectcontact 45, i.e., including both metal lines and vias, is a pure copper,i.e., 100 at. % copper. The pure copper may include incidental oxidationof the copper. In another embodiment, the copper including material is amixture of copper and one or more other metals. A copper-metal mixturecan be a heterogeneous mixture, or alternatively, a homogeneous mixture,such as an alloy. Some alloys of copper include copper-tantalum,copper-manganese, copper-aluminum, copper-titanium, copper-platinum,copper-zinc, copper-nickel, and copper-silver alloys. Generally, thealloys considered herein contain copper in an amount of at least 40% byweight of the alloy, and more generally, at least 50%, 60%, 70%, 80%,90%, 95%, 97%, 98%, or 99% by weight of the alloy. It is noted that anycomposition including copper may be employed for the copper includingstructure 20, so long as the composition is electrically conductive. Itis noted that copper is only one material that is suitable for theinterconnect contact 45, which includes the metal lines and vias, thatare present in the interlevel dielectric layer 15 a. Other metalincluding materials are equally suitable for the interconnect contact 45including aluminum, platinum, silver, tungsten and combinations thereof.

Referring to FIG. 6, in some embodiments, an interconnect structure maybe provided that includes an interlevel dielectric layer 15 a, 15 b thatis present on an electrically conductive feature 20, in which an openingpresent 10 in the interlevel dielectric layer 15 a, 15 b. The opening 10may include a first width W1 at a first depth into the interleveldielectric layer 15 a, 15 b, and a second width W2 at a second depththat is greater than the first depth. The second width is less than thefirst width of the opening 10 and includes a portion of the opening thatextending through the entirety of the interlevel dielectric layer 15 a,15 b into contact with the electrically conductive feature 20. Thecontact, i.e., interconnect contact 45, is present extending through theopening 10 into contact with the electrically conductive feature 20. Agouge 40 is present at the interface of the contact, i.e., interconnectcontact 45, and the electrically conductive feature 20. Further, ashield liner 35, i.e., remaining portions of the shield liner 35 fromthe process described herein, may be present on vertical sidewalls V1,V2 of the opening 10 between the interlevel dielectric layer 15 b, andthe contact 45. The horizontal surfaces H1, H2 of the opening 10 are notdamaged by etch chemistries used to form the gouge 40 40. For example,plasma ions from the subtractive method described above for forming thegouge 40, are not present embedded within the horizontal surfaces H1, H2of the opening 10.

In some examples, the electrically conductive feature is a metal line,and the opening to the electrically conductive feature through theinterlevel dielectric layer 15 a, 15 b includes the via opening having asubstantially circular or multi-sided cross section. The shield liner 35can be a dielectric or electrically conductive material, and can have athickness ranging from 3 nm to 150 nm. In some embodiments, theinterconnect structure that is depicted in FIG. 1 further includes aconformal metal nitride layer, i.e., liner layer 30, present on verticaland horizontal surfaces of the opening, wherein the metal nitride layeris present between the shield liner 35 and the interlevel dielectriclayer 15 b.

The interconnect structure that is described above with reference toFIGS. 1-6 may be employed in any electrical device. For example, theinterconnect structures that are disclosed herein may be present withinelectrical devices that employ semiconductors that are present withinintegrated circuit chips. The integrated circuit chips including thedisclosed interconnects may be integrated with other chips, discretecircuit elements, and/or other signal processing devices as part ofeither (a) an intermediate product, such as a motherboard, or (b) an endproduct. The end product can be any product that includes integratedcircuit chips, including computer products or devices having a display,a keyboard or other input device, and a central processor.

Having described preferred embodiments of a system and method ofREDUCING CONTACT RESISTANCE IN VIAS FOR COPPER INTERCONNECTS, it isnoted that modifications and variations can be made by persons skilledin the art in light of the above teachings. It is therefore to beunderstood that changes may be made in the particular embodimentsdisclosed which are within the scope of the invention as outlined by theappended claims. Having thus described aspects of the invention, withthe details and particularity required by the patent laws, what isclaimed and desired protected by Letters Patent is set forth in theappended claims.

The invention claimed is:
 1. An interconnect structure comprising: acontact present within an opening having at least two widths, whereinthe contact extends into contact with an electrically conductivefeature, wherein a gouge is present in an upper surface of theelectrically conductive feature; and a shield liner present on thesidewalls of the opening, wherein the shield liner includesdiscontinuous segments on each end of opposed ends of the opening. 2.The interconnect structure of claim 1, wherein the shield liner isdefined only outside of the gouge after the contact is deposited.
 3. Theinterconnect structure of claim 1, wherein the electrically conductivefeature is a metal line.
 4. The interconnect structure of claim 1,wherein the opening has a substantially circular or multi-sided crosssection.
 5. The interconnect structure of claim 1, wherein the gougeincludes angled sidewalls.
 6. The interconnect structure of claim 1,wherein the gouge includes a planar base.
 7. The interconnect structureof claim 1, wherein the gouge includes angled sidewalls.
 8. Theinterconnect structure of claim 1, wherein the gouge includes an apex ata base of the gouge.
 9. The interconnect structure of claim 1, whereinthe shield liner is comprised of a dielectric material.
 10. Theinterconnect structure of claim 1, wherein the shield liner is comprisedof an electrically conductive material.
 11. The interconnect structureof claim 1, wherein the shield liner has a thickness ranging from 3 nmto 150 nm.
 12. The interconnect structure of claim 1, further comprisinga conformal metal nitride layer present on vertical and horizontalsurfaces of the opening.
 13. The interconnect structure of claim 1,wherein the conformal metal nitride layer is present between the shieldliner and an interlevel dielectric.
 14. An interconnect structurecomprising: a contact present within an opening having at least twowidths, wherein the contact extends into contact with an electricallyconductive feature, wherein a gouge is present in an upper surface ofthe electrically conductive feature; a metal nitride layer present onthe sidewalls of the opening; and a shield liner present on the metalnitride layer that is present on the sidewalls of the opening, whereinthe shield liner includes discontinuous segments on each end of opposedends of the opening.
 15. The interconnect structure of claim 14, whereinthe shield liner is defined only outside of the gouge after the contactis deposited.
 16. The interconnect structure of claim 14, wherein theelectrically conductive feature is a metal line.
 17. The interconnectstructure of claim 14, wherein the opening has a substantially circularor multi-sided cross section.
 18. The interconnect structure of claim14, wherein the gouge includes angled sidewalls.
 19. The interconnectstructure of claim 14, wherein the gouge includes a planar base.
 20. Theinterconnect structure of claim 14, wherein the gouge includes angledsidewalls.